The 16B double-sided grinding and polishing machine is an efficient precision machining equipment, suitable for double-sided high-precision grinding and polishing of optical glass, ceramics, silicon wafers, germanium wafers, potassium arsenide wafers, quartz crystals, glass and other hard and brittle materials. It is particularly suitable for double-sided precision grinding and processing of silicon wafers with a diameter of 125mm and irregular parallel plane materials of the same size and specifications. By synchronously rotating the upper and lower grinding discs and using grinding fluid or polishing, high-precision flat machining of the workpiece can be achieved.
The main product technical parameters are as follows:
● Model: 16B
● Grinding disc diameter: Ø 1120 mm (adjustable according to configuration)
● Larger grinding diameter: Ø 350mm
● Larger grinding thickness: 20mm
● Grinding disc speed: adjustable from 0-90
● Pressure application method: pneumatic/hydraulic
● Power supply: 380V
● Power: 30KW
● Equipment size: approximately 2300mm × 1620mm × 3400mm
Scan
Home
Tel
Product